{"id":12152,"date":"2023-04-19T11:52:57","date_gmt":"2023-04-19T08:52:57","guid":{"rendered":"https:\/\/bestessayhomework.com\/tr\/?p=12152"},"modified":"2023-04-19T11:52:57","modified_gmt":"2023-04-19T08:52:57","slug":"tasarim-kisitlamalari-basim-teknolojileri-basim-teknolojileri-odevleri-basim-teknolojileri-odev-ucretleri-basim-teknolojileri-bolumu","status":"publish","type":"post","link":"https:\/\/bestessayhomework.com\/tr\/tasarim-kisitlamalari-basim-teknolojileri-basim-teknolojileri-odevleri-basim-teknolojileri-odev-ucretleri-basim-teknolojileri-bolumu\/","title":{"rendered":"Tasar\u0131m K\u0131s\u0131tlamalar\u0131 \u2013 Bas\u0131m Teknolojileri \u2013 Bas\u0131m Teknolojileri \u00d6devleri \u2013 Bas\u0131m Teknolojileri \u00d6dev \u00dccretleri \u2013 Bas\u0131m Teknolojileri B\u00f6l\u00fcm\u00fc"},"content":{"rendered":"

Tasar\u0131m K\u0131s\u0131tlamalar\u0131<\/span><\/strong><\/h3>\n

SLS i\u00e7i bo\u015f profillerle ili\u015fkili tasar\u0131m k\u0131s\u0131tlamalar\u0131ndan biri, ka\u00e7\u0131\u015f delikleri ihtiyac\u0131d\u0131r. SLA gibi, bir bask\u0131 tamamland\u0131ktan sonra yap\u0131 malzemesi i\u00e7i bo\u015f b\u00f6l\u00fcm\u00fcn i\u00e7inden \u00e7\u0131kar\u0131lmal\u0131d\u0131r. SLS i\u00e7in, toz tipik olarak bas\u0131n\u00e7l\u0131 hava yoluyla \u00e7\u0131kar\u0131l\u0131r. Minimum ka\u00e7\u0131\u015f deli\u011fi \u00e7ap\u0131 10 mm (veya 5 mm \u00e7ap\u0131nda 2 delik) oldu\u011fundan daha fazla delik her zaman istenir.<\/span><\/p>\n

\u0130\u00e7i Bo\u015f B\u00f6l\u00fcmler<\/span><\/strong><\/p>\n

SLS, par\u00e7a \u00fcretmek i\u00e7in destek malzemesine ba\u011fl\u0131 olmad\u0131\u011f\u0131ndan, i\u00e7i bo\u015f profillerin \u00fcretimi i\u00e7in en iyi 3D bask\u0131 teknolojilerinden biridir; di\u011fer teknolojilerin kald\u0131r\u0131lmas\u0131 zor olan dahili deste\u011fe ihtiyac\u0131 oldu\u011fundan. \u0130\u00e7i bo\u015f b\u00f6l\u00fcmler a\u011f\u0131rl\u0131\u011f\u0131n azalt\u0131lmas\u0131na olanak tan\u0131r ve daha az malzeme kullan\u0131ld\u0131\u011f\u0131 i\u00e7in bask\u0131 maliyetini d\u00fc\u015f\u00fcr\u00fcr.<\/span><\/p>\n

Oyuk hacmi artt\u0131k\u00e7a ka\u00e7\u0131\u015f deli\u011fi \u00e7ap\u0131 ve s\u0131kl\u0131\u011f\u0131 art\u0131r\u0131lmal\u0131d\u0131r. Ka\u00e7\u0131\u015f deli\u011fi eklenmesi, bir par\u00e7an\u0131n g\u00f6r\u00fcn\u00fcm\u00fc veya performans\u0131 \u00fczerinde olumsuz bir etkiye sahipse, bask\u0131dan sonra kapat\u0131labilir veya doldurulabilir.<\/span><\/p>\n

Ka\u00e7\u0131\u015f delikleri i\u00e7ermeyen i\u00e7i bo\u015f kesitli par\u00e7alar \u00fcretmek m\u00fcmk\u00fcnd\u00fcr. Bunu yaparak par\u00e7alar, bask\u0131n\u0131n i\u00e7inde s\u0131k\u0131ca paketlenmi\u015f, sinterlenmemi\u015f tozla bas\u0131l\u0131r ve tasar\u0131m\u0131n kat\u0131 sinterlenmi\u015f bir par\u00e7aya e\u015fde\u011fer bir k\u00fctleyi korumas\u0131na, ancak \u00e7ok daha k\u0131sa bir zaman diliminde \u00fcretilmesine olanak tan\u0131r.<\/span><\/p>\n

Sinterlenmemi\u015f toz tekni\u011fi kullan\u0131ld\u0131\u011f\u0131nda \u00fcretilen par\u00e7alar tamamen sinterlenmi\u015f bir par\u00e7aya g\u00f6re \u00e7ok daha zay\u0131ft\u0131r.<\/span>
\nSLS par\u00e7alar\u0131 tipik olarak 1-3 mm kal\u0131nl\u0131\u011f\u0131nda kat\u0131, tamamen yo\u011fun duvarlarla bas\u0131l\u0131r. Par\u00e7a mukavemetini art\u0131rmak i\u00e7in duvar kal\u0131nl\u0131\u011f\u0131 art\u0131r\u0131labilir veya sinterlenmemi\u015f tozla birlikte tasar\u0131m\u0131n i\u00e7i bo\u015f b\u00f6l\u00fcm\u00fcne petek, kafes yap\u0131s\u0131 dahil edilebilir.<\/span><\/p>\n

K\u00f6r Delikler<\/span><\/strong><\/p>\n

Genel bir kural olarak, SLS ile yazd\u0131r\u0131rken k\u00f6r delikler (bir par\u00e7an\u0131n i\u00e7inden tamamen ge\u00e7meyen bir delik) tasarlamaktan ka\u00e7\u0131nmak en iyisidir. K\u00f6r delikler tozun \u00e7\u0131kar\u0131lmas\u0131n\u0131 zorla\u015ft\u0131r\u0131r. K\u00f6r delik a\u00e7\u0131k delik olarak tasarlanam\u0131yorsa, t\u00fcm tozun \u00e7\u0131kar\u0131lmas\u0131 olas\u0131l\u0131\u011f\u0131n\u0131 art\u0131rmak i\u00e7in, g\u00f6sterilen \u00f6zelliklerin temelinde k\u00fc\u00e7\u00fck bir delik (\u00e7ap\u0131 en az 2 mm) olmas\u0131 \u00f6nerilir.<\/span><\/p>\n

Hareketli Par\u00e7alar<\/span><\/strong><\/h3>\n

SLS, hareketli par\u00e7alar\u0131 tek bir yap\u0131ya entegre edebilen birka\u00e7 3D bask\u0131 teknolojisinden biridir; \u00e7evreleyen tozun sundu\u011fu destek bunu m\u00fcmk\u00fcn k\u0131lar. Hareketli par\u00e7alar ile yatak y\u00fczeyleri aras\u0131ndaki bo\u015fluk, par\u00e7a geometrisine g\u00f6re de\u011fi\u015fir. Par\u00e7alar b\u00fcy\u00fcd\u00fck\u00e7e daha fazla \u0131s\u0131 tutarlar, bu da a\u015f\u0131r\u0131 sinterleme ve hareketli par\u00e7alar\u0131n birbirine kayna\u015fma \u015fans\u0131n\u0131n artmas\u0131na neden olur.<\/span><\/p>\n

Genel bir kural olarak, \u00e7ap\u0131 10 mm’den k\u00fc\u00e7\u00fck miller i\u00e7in, t\u00fcm hareketli y\u00fczeyler aras\u0131nda minimum 0,3 mm’lik (her bir tarafta 0,15 mm) bo\u015fluk \u00f6nerilir. \u00c7ap\u0131 10 mm’den b\u00fcy\u00fck par\u00e7alar i\u00e7in bu bo\u015fluk 0,5 mm’ye (her bir tarafta 0,25 mm) y\u00fckseltilmelidir.<\/span><\/p>\n

A\u015f\u0131r\u0131 sinterlemenin meydana gelme olas\u0131l\u0131\u011f\u0131n\u0131 daha da azaltmak i\u00e7in daha b\u00fcy\u00fck bo\u015fluklar \u00f6nerilir, ancak bu genellikle gerekli olan uyum t\u00fcr\u00fc taraf\u0131ndan k\u0131s\u0131tlan\u0131r.<\/span><\/p>\n

M\u00fcmk\u00fcnse, bir tasar\u0131ma \u00f6zel ta\u015f\u0131ma y\u00fczeylerinin eklenmesi ve di\u011fer t\u00fcm hareketli y\u00fczeyler aras\u0131nda minimum 4 mm’lik (her bir tarafta 2 mm) bo\u015fluk b\u0131rak\u0131lmas\u0131 \u00f6nerilir. Bu, tozun \u00e7\u0131kar\u0131lmas\u0131na yard\u0131mc\u0131 olacak ve a\u015f\u0131r\u0131 sinterleme olas\u0131l\u0131\u011f\u0131n\u0131 azaltacakt\u0131r. Toz gidermeye daha fazla yard\u0131mc\u0131 olmak i\u00e7in yatak y\u00fczeyleri aras\u0131na bir ka\u00e7\u0131\u015f deli\u011fi eklemeyi de d\u00fc\u015f\u00fcn\u00fcn.<\/span><\/p>\n

\n

G\u0131da M\u00fchendisli\u011fi tasar\u0131m<\/a> dersi Ders notlar\u0131<\/span>
\nBoru hatt\u0131 Tasar\u0131m\u0131<\/span>
\nKimyasal Proses ekipmanlar\u0131 ders Notlar\u0131<\/span>
\n\u00dcretim proses \u00f6rnekleri<\/span>
\nK\u00fctle denkli\u011fi hesaplama<\/span>
\nReakt\u00f6rde enerji denkli\u011fi<\/span><\/p>\n

\n

Enjeksiyon Kal\u0131plama ile Kar\u015f\u0131la\u015ft\u0131rma<\/span><\/strong><\/h3>\n

SLS par\u00e7alar\u0131, daha sonra enjeksiyon kal\u0131plama ile seri \u00fcretilecek olan tasar\u0131mlar\u0131n bi\u00e7imini, uyumunu ve i\u015flevini belirlemek i\u00e7in genellikle prototip olarak kullan\u0131l\u0131r.<\/span><\/p>\n

Enjeksiyon kal\u0131plamaya k\u0131yasla SLS i\u00e7in par\u00e7a tasarlama aras\u0131ndaki temel farklar \u015funlard\u0131r:<\/span><\/strong><\/p>\n

\u00b7 SLS par\u00e7alar\u0131n\u0131n bir kal\u0131ptan \u00e7\u0131kar\u0131lmas\u0131na gerek yoktur, SLS alttan kesmeleri, negatif draft\u0131 ve i\u00e7 \u00f6zellikleri kolayca \u00fcretebilir. Negatif taslak \u00fcretme yetene\u011fi genellikle contalar\u0131n ve o-ringlerin sabitlenmesi i\u00e7in uygulan\u0131r.<\/span>
\n\u00b7 M\u00fckemmel keskin kenarlar ve k\u00f6\u015feler SLS ile \u00fcretilemez. SLS i\u015flemi, t\u00fcm kenarlarda ve k\u00f6\u015felerde yar\u0131\u00e7ap\u0131 \u00b10,4 mm olan par\u00e7alar \u00fcretir. Bir tasar\u0131mda 0,4 mm’den k\u00fc\u00e7\u00fck yar\u0131\u00e7aplar 0,4 mm olarak yazd\u0131r\u0131lacakt\u0131r. Bunun nedeni lazerin yuvarlak profili ve lazer \u00e7ap\u0131ndan kaynaklanmaktad\u0131r.<\/span>
\n\u00b7 SLS taraf\u0131ndan \u00fcretilen do\u011fal yar\u0131\u00e7ap, bir miktar stres giderme sa\u011flar. \u0130lgili alanlar i\u00e7in daha b\u00fcy\u00fck bir yar\u0131\u00e7ap (2 mm’den b\u00fcy\u00fck) eklenmelidir.<\/span><\/p>\n

SLS, par\u00e7a yazd\u0131rma deste\u011fine ba\u011fl\u0131 olmasa da, par\u00e7alar\u0131n nas\u0131l olu\u015fturuldu\u011fuyla ilgili hala s\u0131n\u0131rlamalar vard\u0131r. 45\u00b0’den k\u00fc\u00e7\u00fck a\u00e7\u0131lar i\u00e7in, katman basamaklar\u0131 g\u00f6r\u00fcn\u00fcr hale gelecek ve 30\u00b0’den k\u00fc\u00e7\u00fck a\u00e7\u0131lar y\u00fczeyde basamakl\u0131 g\u00f6r\u00fcn\u00fcm\u00fcn \u00e7ok belirgin hale gelmesiyle sonu\u00e7lanacakt\u0131r. Bu, \u00f6zellikle yatay eksen deliklerinin \u00fcst y\u00fczeyinde yayg\u0131nd\u0131r.<\/span><\/p>\n

SLS yaz\u0131c\u0131lar\u0131n\u0131n par\u00e7a \u00fcretmek i\u00e7in kulland\u0131\u011f\u0131 y\u00f6ntem nedeniyle, ad\u0131mlama etkisinden ka\u00e7\u0131nmak genellikle zordur. En yayg\u0131n \u00e7\u00f6z\u00fcm, par\u00e7alar\u0131 toz kutusu i\u00e7inde farkl\u0131 bir y\u00f6ne y\u00f6nlendirmektir.<\/span><\/p>\n

Bir deli\u011fin tepesine d\u00fcz bir y\u00fczey eklemek, par\u00e7an\u0131n i\u015flevselli\u011fini etkileyebilse de p\u00fcr\u00fczs\u00fcz bir y\u00fczey kaplamas\u0131n\u0131n korunmas\u0131na da yard\u0131mc\u0131 olacakt\u0131r. P\u00fcr\u00fczs\u00fcz bir y\u00fczey gerekiyorsa, deli\u011fi k\u00fc\u00e7\u00fck boyutta yazd\u0131rmak ve ard\u0131ndan bask\u0131dan sonra z\u0131mparalamak veya makinede i\u015flemek genellikle en iyi \u00e7\u00f6z\u00fcmd\u00fcr.<\/span><\/p>\n

Malzeme P\u00fcsk\u00fcrtme i\u00e7in Tasar\u0131m<\/span><\/strong><\/h3>\n

Material Jetting, \u00e7ok p\u00fcr\u00fczs\u00fcz bir y\u00fczeye sahip y\u00fcksek detayl\u0131 par\u00e7alar \u00fcreten, en do\u011fru 3D bask\u0131 teknolojilerinden biridir. Tam renkli veya \u00e7ok malzemeli par\u00e7alar sunan baz\u0131 Material Jetting yaz\u0131c\u0131larda, g\u00f6rsel prototipler \u00fcretmek i\u00e7in Material Jetting d\u00fczenli olarak kullan\u0131l\u0131r.<\/span><\/p>\n

Malzeme P\u00fcsk\u00fcrtme i\u015flemi s\u0131ras\u0131nda mevcut olan \u0131s\u0131 eksikli\u011fi ve \u00e7\u00f6z\u00fcnebilir destek malzemesinin kullan\u0131lmas\u0131, minimum \u00f6zellik boyutlar\u0131n\u0131n d\u0131\u015f\u0131nda birka\u00e7 s\u00fcrece \u00f6zel tasar\u0131m kural\u0131 ile y\u00fcksek d\u00fczeyde tasar\u0131m \u00f6zg\u00fcrl\u00fc\u011f\u00fc sa\u011flar.\u00a0<\/span>Malzeme P\u00fcsk\u00fcrtme i\u00e7in tasar\u0131m \u00f6nerilerinin \u00e7o\u011fu, destek malzemesinin \u00e7\u0131kar\u0131lmas\u0131 i\u00e7in yeterli alan sa\u011flamaya odaklan\u0131r.<\/span><\/p>\n

\u00c7o\u011fu 3B bask\u0131 teknolojisinde oldu\u011fu gibi, Malzeme P\u00fcsk\u00fcrtme, par\u00e7alar\u0131 do\u011fru bir \u015fekilde yazd\u0131rmak i\u00e7in destek malzemesinin kullan\u0131lmas\u0131n\u0131 gerektirir. Baz\u0131 FFF yaz\u0131c\u0131larda oldu\u011fu gibi, Material Jetting, bask\u0131 tamamland\u0131ktan sonra \u00e7\u0131kar\u0131lan mum benzeri, \u00e7\u00f6z\u00fcnebilir ikincil bir malzemeden bask\u0131 deste\u011fi al\u0131r.<\/span><\/p>\n

Destek malzemesini manuel olarak \u00e7\u0131karma ihtiyac\u0131, Malzeme P\u00fcsk\u00fcrtme par\u00e7alar\u0131n\u0131n tasar\u0131m\u0131na s\u0131n\u0131rlamalar getirir. Tamamen kapat\u0131lm\u0131\u015f bo\u015fluklar, \u00e7\u0131kar\u0131lamayan destek malzemesi ile tamamen doldurulacakt\u0131r. Ayr\u0131ca uzun, dar oyuklar\u0131n veya k\u00fc\u00e7\u00fck deliklerin temizlenmesi \u00e7ok zordur. Bu nedenle, herhangi bir delik veya kanal\u0131n geni\u015fli\u011fi 0,5 mm’den b\u00fcy\u00fck olmal\u0131d\u0131r (derinlik-geni\u015flik oran\u0131 2:1 olan kanallar\u0131n temizlenmesi \u00f6zellikle zordur).<\/span><\/p>\n

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